The National Science Foundation (NSF) has awarded $2 million to the Center for Biological Interfaces of Engineering (CBIOE) at Clemson University for the development of engineered tissues that will be used to study the causes, progression and treatment of breast cancer.

The tissue engineering technology, which was pioneered at Clemson, is based on inkjet printing and will allow the creation of identical tissue samples that can be used to build cause and effect models.

"We will expose these identical tissue models to different environmental conditions to better understand what causes and then stimulates the development of breast cancer. Our research team includes breast cancer surgeons, engineers and scientists -- the breadth of expertise is tremendous and absolutely crucial for this very complex problem," said CBIOE director Karen Burg, who will lead the multi-disciplinary research team.

Other collaborating investigators include Steve Ellis and Susan Duckett in animal and veterinary sciences, Thomas Boland in bioengineering, Amy Moran in biological sciences, Jason McNeill in chemistry and Rick Groff and Timothy Burg in electrical and computer engineering. The initiative will benefit from input from CBIOE partnering institutions Carolinas Medical Center, the University of North Carolina at Chapel Hill and the University of North Carolina at Charlotte.

The CBIOE, located in Rhodes Engineering Research Building at Clemson University, is a state approved research and training center. Its mission is to promote the development of clinically relevant biomaterials technology and products for disease treatment and the transfer of this technology for patient care.

The NSF grant was among seven awarded to institutions to advance basic knowledge and control in the area of cellular and biomolecular engineering through the newly established NSF Emerging Frontiers in Research Innovation Office (EFRI). Other institutions receiving EFRI awards are John Hopkins University, University of Maryland, Massachusetts Institute of Technology (MIT), Stanford University, University of Virginia and University of Wisconsin.